Wednesday 1 September 2021

How to Recover Gold from Cell Phone Motherboard Chips | Gold Recovery | Recycling E-waste

I have seen videos of people removing components from cell phones' motherboards and other types of electronic circuit boards with the help of a chisel and hammer. That's so much time-consuming, and you can't process bulk quantity through this method. if you are serious about this business and want to progress fast, you must first understand its nature. Until some years ago the profit margin was high, but now it is only up to 15% on a small scale. Because so many people are attracted to this line on account of gold and other precious metals recovery. And so, the competition is increasing day by day. So, your profit depends on careful purchasing of the raw material and its processing cost. As for removing the components from the circuit boards, you may use a solder-stripper. These days we can easily get a solder stripper in the market that doesn't attack other metals such as copper and nickel etc. It is available at an affordable price. You can prepare the solder-stripper yourself also. So, for gold recovery, you first need to remove the components with a solder stripper. These circuit boards contain precious metals such as gold, silver, and palladium, etc.., but in this article, we will discuss gold extraction only. For this, first of all, we need to burn the chips in an environmentally friendly way. The chips are ground into a fine powder after burning. And in the third step, metal is separated from the ash using a sieve. There are many ways to recover gold from the separated metals, but I would like to mention only two processes here. In the first method gold is leached with chemicals and then refined. Another method is to melt the metals into an ingot and recover gold through electrolysis. The second part of this article will deal with the recovery of metals such as silver and palladium. You can write to us through the contact form available on our blog If you want to learn the gold extraction process in detail. Warning! The reproduction of all or part of this article in any form is strictly prohibited. This is Part-1, and Part-2 of this article is coming soon.

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